Objectives are microelectronic packaging materials, textile electronics, and synthetic as well as natural polymer yarns. The details of investigation include the quantitative interpretation of structure-related kinetics of transient creep and plastic instability of polycrystalline fcc. metal wire and of polymers with partial crystallization of the macromolecules.
MATERIALS / STRUCTURES
ICR - MATERIALS / STRUCTURES
Failure analysis
Investigated are typical microscopic failure morphologies and their physical background:
- Microcrack and pore formation in polycrystalline metals
- Brittle and ductile crack extension
- Delamination of thinfilm metallizations
Mechanics
Viscoelastic flow of materials depends sensitively on the microstructure:
- Inhomogeneous stress-strain relationship, strain hardening, plastic instability -> time-to-fracture
- Measurement of low creep rates down to 10**(-9) /s for prediction of long term degradation
- Fatigue mechanics of small-sized samples
Applications
include the fatigue behaviour of contacts, and the wear behaviour of textile sensors. The development of innovative textile electronics is based on innovative constructions with use of
weaving and braiding technologies.